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CBTU0808
Dual lane PCI Express port multiplexer
Rev. 01 -- 2 June 2006 Product data sheet
1. General description
The CBTU0808 is a dual lane port multiplexer designed to provide convenient and reliable path switching for PCI Express signals. It is organized as two PCI Express lanes, each consisting of a Transmit and Receive channel. Each channel has four ports, two (A and B) on the source (or host) side and two (A and B) on the destination (or device) side. Each port provides a pair of signal lines to support PCIe differential signaling. Using specially designed high-bandwidth and high off-isolation switch elements, source and destination ports can be connected or isolated in three possible configurations: source A and B to destinations A and B respectively; or source A to destination B (remaining ports isolated), or all ports isolated. The switch elements are controlled by internal control logic to set switch positions in accordance with these three configurations, selectable by CMOS inputs CTRL0 and CTRL1 for lanes 0 and 1 respectively. Within a lane, the switch configuration is always applied identically to both transmit and receive channels. The CBTU0808 is packaged in a 48-ball, depopulated 9 x 9 grid, 0.5 mm ball pitch, thin profile fine-pitch ball grid array (TFBGA) package, which (while requiring a minimum 5 mm x 5 mm of board space) allows for adequate signal routing and escape using conventional board technology.
2. Features
I I I I I I I I I I I 2-lane wide PCI Express port multiplexer One transmit and one receive differential channel per lane Four ports per channel PCI Express signaling compliant High bandwidth: > 1 GHz Low OFF-feedthrough of < -35 dB at 1.25 GHz Low channel crosstalk of < -35 dB at 1.25 GHz Designed to match characteristic impedance of PCIe signaling environment Single 1.8 V supply operation ESD resilience of 2 kV HBM Available in 48-ball, 5 mm x 5 mm, 0.5 mm ball pitch TFBGA package, Pb-free/Green
3. Applications
I High-performance computing applications I Port switching and docking applications
Philips Semiconductors
CBTU0808
Dual lane PCI Express port multiplexer
4. Ordering information
Table 1. Ordering information Solder process Package Name CBTU0808EE/G Pb-free (SnAgCu solder ball compound) TFBGA48 Description plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm Version SOT918-1 Type number
5. Functional diagram
CBTU0808
CTRL[1:0] TEST[1:0] TXSA0P TXSA0N channel Tx0 TXSB0P TXSB0N LANE 0 RXSA0P RXSA0N channel Rx0 RXSB0P RXSB0N RXDB0P RXDB0N RXDA0P RXDA0N TXDB0P TXDB0N CONTROL AND CONFIGURATION
TXDA0P TXDA0N
TXSA1P TXSA1N channel Tx1 TXSB1P TXSB1N LANE 1 RXSA1P RXSA1N channel Rx1 RXSB1P RXSB1N
TXDA1P TXDA1N
TXDB1P TXDB1N RXDA1P RXDA1N
RXDB1P RXDB1N
002aac139
Fig 1. Functional diagram
CBTU0808_1
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Product data sheet
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CBTU0808
Dual lane PCI Express port multiplexer
6. Pinning information
6.1 Pinning
ball A1 index area
CBTU0808EE/G
123456789
A B C D E F G H J
002aac213
Transparent top view
Fig 2. Pin configuration for TFBGA48
1 A B C D E F G H J TXSB1P TEST0 RXSB0P GND TXSA1P CTRL0 RXSA0P
2 TXSB0P GND RXSA0N RXSB0N VDD TXSA1N TXSB1N GND RXSA1P
3
4 TXSA0P
5 GND VDD
6 TXDA0P TXDA0N
7
8 TXDB0P
9 TEST1 RXDA0P
TXSB0N
TXSA0N
TXDB0N
GND RXDA0N RXDB0N VDD TXDA1N TXDB1N
RXDB0P GND TXDA1P
RXSA1N
RXSB1N RXSB1P
VDD GND
RXDB1N RXDB1P
RXDA1N
GND RXDA1P
TXDB1P CTRL1
002aac212
48-ball, 9 x 9 grid; top view. An empty cell indicates no ball is populated at that grid point.
Fig 3. Ball mapping
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Product data sheet
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CBTU0808
Dual lane PCI Express port multiplexer
6.2 Pin description
Table 2. Test and control Pin description Symbol CTRL0 CTRL1 TEST0 Pin A1 J9 J1 Type CMOS input CMOS input Description Switch configuration control inputs. See Table 3 "Switch configuration truth table". Test input. Used for test purposes only. Should be left open-circuit during normal operation. An internal pull-down resistor will default this pin to a LOW state. Test output. Used for test purposes only. Should be left open-circuit in normal application. Transmit ports A and B differential signal terminals for Lane 0, Source side. Receive ports A and B differential signal terminals for Lane 0, Source side. Transmit ports A and B differential signal terminals for Lane 1, Source side. Receive ports A and B differential signal terminals for Lane 1, Source side. Transmit ports A and B differential signal terminals for Lane 0, Destination side. Receive ports A and B differential signal terminals for Lane 0, Destination side. Transmit ports A and B differential signal terminals for Lane 1, Destination side. Receive ports A and B differential signal terminals for Lane 1, Destination side. power supply pins ground pins Signal group
TEST1
A9
output
Signal ports
TXSA0P, TXSA0N, TXSB0P, TXSB0N
A4, B4, A2, B3
signal port signal port signal port signal port signal port signal port signal port signal port power power
RXSA0P, RXSA0N, B1, C2, RXSB0P, RXSB0N D1, D2 TXSA1P, TXSA1N, TXSB1P, TXSB1N F1, F2, H1, G2
RXSA1P, RXSA1N, J2, H3, RXSB1P, RXSB1N J4, H4 TXDA0P, TXDA0N, TXDB0P, TXDB0N A6, B6, A8, B7
RXDA0P, RXDA0N, B9, C8, RXDB0P, RXDB0N D9, D8 TXDA1P, TXDA1N, TXDB1P, TXDB1N F9, F8, H9, G8
RXDA1P, RXDA1N, J8, H7, RXDB1P, RXDB1N J6, H6 Power VDD GND B5, E2, E8, H5 A5, B2, B8, E1, E9, H2, H8, J5
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Product data sheet
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CBTU0808
Dual lane PCI Express port multiplexer
7. Functional description
7.1 Functional description
7.1.1 General information
The CBTU0808 Dual lane PCI Express port multiplexer is designed to allow port switching of up to two PCI Express lanes (each including a Transmit and Receive channel) according to three switch configuration settings (described in Section 7.1.2.1). The basic switch element of the CBTU0808 is designed integrally with its package and chip interconnect to present an optimum characteristic on-impedance when used in a PCI Express signaling environment, and to provide high off-port isolation and low crosstalk.
7.1.2 Functional information
The following paragraphs describe the control and configuration possibilities available in the CBTU0808. 7.1.2.1 Switch configuration The position of the port switches is controlled by CMOS input signals CTRL[1:0] and can be overridden by CMOS input TEST0 to disconnect (open) all ports between source and destination. For a given lane, the switch positions are always identical between transmit and receive channels. Lane 0 is controlled by CTRL0 and Lane 1 is controlled by CTRL1. The truth table for the switch position as a function of these inputs is shown in Table 3.
Table 3. Inputs CTRLn[1] LOW HIGH[2] LOW > LOW
[1] [2]
Switch configuration truth table Function TEST0 LOW LOW HIGH HIGH Source ports[1] An Bn An Bn An Bn Destination ports A Ron high-Z high-Z high-Z high-Z high-Z B high-Z Ron Ron high-Z high-Z high-Z SA:DA/SB:DB (Dual Through mode) SA:DB (Single Cross mode) All ports open-circuit (Disconnect mode) do not use Comment
Test mode for internal use only
n is the Lane number (0 or 1). CTRL1 or CTRL0 = HIGH.
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Product data sheet
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CBTU0808
Dual lane PCI Express port multiplexer
8. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD VI IIK IOK IO ICCC Tstg Vesd Parameter supply voltage input voltage input clamping current output clamping current output current continuous current through each VDD or GND pin storage temperature electrostatic discharge voltage Human Body Model; 1.5 k; 100 pF Machine Model; 0 ; 200 pF
[1]
[1]
Conditions
Min -0.5 -0.5 -65 >2 >200
Max +2.5 +2.5 -50 50 50 100 +150 -
Unit V V mA mA mA mA C kV V
VI < 0 V or VI > VDD VO < 0 V or VO > VDD continuous; 0 V < VO < VDD
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
9. Recommended operating conditions
Table 5. Symbol VDD VI VIH VIL VICR VI(dif)(p-p) Tamb
[1] [2]
Recommended operating conditions Parameter supply voltage input voltage HIGH-level input voltage LOW-level input voltage common mode input voltage range peak-to-peak differential input voltage ambient temperature TXn and RXn ports CTRL[1:0], TEST inputs CTRL[1:0], TEST[1:0] inputs TXn and RXn ports TXn and RXn ports operating in free air
[2] [1] [1]
Conditions
Min 1.7 -0.25 0.65 x VDD 0 0
Typ -
Max 1.9 +1.75 VDD 0.35 x VDD 1.5 1.2 +85
Unit V V V V V V C
The CTRL[1:0] inputs of the device must be held at valid levels (not floating) to ensure proper device operation. VI(dif)(p-p) = 2 x |VTX_D+ - VTX_D-|. See Paragraph 4.3.3, Table 4-5 of Ref. 1.
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Product data sheet
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CBTU0808
Dual lane PCI Express port multiplexer
10. Static characteristics
Table 6. Static characteristics Over recommended operating conditions, unless otherwise noted. Symbol IDD ILI Ci ILI Ron(sw) Ron(sw) CS(ON) Parameter supply current input leakage current input capacitance input leakage current switch on-state resistance switch on-state resistance variation ON-state capacitance over recommended VID (input voltage) range VI = 0.9 V switch; simulated value of the silicon switch only, excluding package parasitics
[1] Static operating current.
Conditions
[1]
Min -100 8 -
Typ 10 0.5
Max 1 5 5 +100 12 0.75
Unit mA A pF A
Digital inputs CTRL[1:0] and TEST0 VI = VDD or GND VI = VDD or GND VI = VDD or GND; TEST0 = HIGH (Disconnect mode)
Signal ports TXSA0P ... RXDB1N
-
3.6
4.75
pF
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Dual lane PCI Express port multiplexer
11. Dynamic characteristics
Table 7. Dynamic characteristics Over recommended operating conditions, unless otherwise noted. Characterization bandwidth: 10 MHz < foper < 6 GHz. Symbol Parameter tPD tstartup trcfg tsk(o) tsk(edge) tsk(dif) s12 propagation delay start-up time reconfiguration time output skew time edge skew time Conditions Figure 5 supply voltage valid to switch specified operating characteristics CTRL[1:0], TEST0 setting change to switch specified operating characteristics difference in propagation delay between any two `ON' paths within a channel; Figure 6 difference of rising edge propagation delay to falling edge propagation delay; Figure 7 Min Typ 60 Max 100 100 40 40 5 Unit ps s s ps ps ps
differential skew time difference in propagation delay between two members of a differential pair; Figure 8 reverse transmission coefficient Differential mode ON insertion loss; ON-state f = 50 MHz f = 625 MHz f 1.25 GHz
-0.8 -2 -3.3 -0.8 -2 -3.3 -
-
-20 -8 -6.0 -20 -8 -6.0
dB dB dB dB dB dB dB dB dB dB dB dB
s21
forward transmission coefficient
Differential mode ON insertion loss; ON-state f = 50 MHz f = 625 MHz f 1.25 GHz
s11
input reflection coefficient
Differential mode ON return loss; ON-state f = 50 MHz f = 625 MHz f 1.25 GHz
s22
output reflection coefficient
Differential mode ON return loss; ON-state f = 50 MHz f = 625 MHz f 1.25 GHz
s12
reverse transmission coefficient
Differential mode port-to-port crosstalk; ON/OFF-state f = 50 MHz f = 625 MHz f = 1.25 GHz -35 -35 -35 dB dB dB
s21
forward transmission coefficient
Differential mode port-to-port crosstalk; ON/OFF-state f = 50 MHz f = 625 MHz f = 1.25 GHz -35 -35 -35 dB dB dB
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Product data sheet
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CBTU0808
Dual lane PCI Express port multiplexer
Table 7. Dynamic characteristics ...continued Over recommended operating conditions, unless otherwise noted. Characterization bandwidth: 10 MHz < foper < 6 GHz. Symbol Parameter s12 reverse transmission coefficient Conditions Differential mode off-port feedthrough; OFF-state f = 50 MHz f = 625 MHz f = 1.25 GHz s21 forward transmission coefficient Differential mode off-port feedthrough; OFF-state f = 50 MHz f = 625 MHz f = 1.25 GHz -35 -35 -35 dB dB dB -35 -35 -35 dB dB dB Min Typ Max Unit
0 s11, s21, s12, s22 (dB) -6
002aac278
(1)
(2)
-12
-18
-24 0 1.25 2.50 3.75 f (GHz) 5.00
(1) insertion loss (2) return loss
Fig 4. S parameters
1.8 V input 0.9 V 0.9 V 0V tPLH output Vref tPHL VOH Vref VOL 002aac274 output tsk(o) output
VOH VOL VOH VOL 002aac275
Fig 5. Propagation delay
Fig 6. Output skew
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CBTU0808
Dual lane PCI Express port multiplexer
1.8 V input 0.9 V tPLH 0.9 V 0V tPHL VOH output 0.9 V 0.9 V VOL 002aac277 input 0.9 V 0.9 V tsk(dif) tsk(dif) input 0.9 V 0.9 V
1.8 V 0V
1.8 V 0V
002aac276
tsk(edge) = |tsk(edge) rising - tsk(edge) falling|
Fig 7. Edge skew
Fig 8. Differential skew
12. Test information
TXSx, RXSx
DUT
TXDx, RXDx
CL 6 pF 50
002aac273
CL represents board and jig and does not indicate additional capacitance. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; slew rate = 2.5 V/ns
Fig 9. Test circuit
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Dual lane PCI Express port multiplexer
13. Package outline
TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm SOT918-1
D
B
A
ball A1 index area
E
A
A2
A1
detail X
e1 e b v w
M M
CAB C
C y1 C y
J H G F E D C B A
e
e2
ball A1 index area
1
2
3
4
5
6
7
8
9
X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 1.15 A1 0.25 0.15 A2 0.90 0.75 b 0.35 0.25 D 5.1 4.9 E 5.1 4.9 e 0.5 e1 4 e2 4 v 0.15 w 0.05 y 0.08 y1 0.1
OUTLINE VERSION SOT918-1
REFERENCES IEC --JEDEC MO-195 JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 05-09-21 05-10-13
Fig 10. Package outline SOT918-1 (TFBGA48)
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Product data sheet
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Dual lane PCI Express port multiplexer
14. Soldering
14.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow temperatures range from 215 C to 260 C depending on solder paste material. The peak top-surface temperature of the packages should be kept below:
Table 8. SnPb eutectic process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 240 C + 0/-5 C 225 C + 0/-5 C Volume mm3 350 225 C + 0/-5 C 225 C + 0/-5 C
Package thickness < 2.5 mm 2.5 mm Table 9.
Pb-free process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 260 C + 0 C 260 C + 0 C 250 C + 0 C Volume mm3 350 to 2000 260 C + 0 C 250 C + 0 C 245 C + 0 C Volume mm3 > 2000 260 C + 0 C 245 C + 0 C 245 C + 0 C
Package thickness < 1.6 mm 1.6 mm to 2.5 mm 2.5 mm
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
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Dual lane PCI Express port multiplexer
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
14.5 Package related soldering information
Table 10. Package[1] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[8],
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable[4] Reflow[2] suitable suitable
suitable not not WQCCN..L[8] recommended[5][6] recommended[7]
suitable suitable suitable not suitable
PMFP[9],
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
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CBTU0808
Dual lane PCI Express port multiplexer
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5] [6] [7] [8]
[9]
15. Abbreviations
Table 11. Acronym CMOS PCI PCIe DUT ESD HBM PRR MM Abbreviations Description Complementary Metal Oxide Semiconductor Peripheral Component Interconnect PCI Express Device Under Test ElectroStatic Discharge Human Body Model Pulse Repetition Rate Machine Model
16. References
[1] PCI Express Base Specification, Rev 1.1 -- Revision 1.1, March 2005.
17. Revision history
Table 12. Revision history Release date 20060602 Data sheet status Product data sheet Change notice Supersedes Document ID CBTU0808_1
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18. Legal information
18.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.
18.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
18.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
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Dual lane PCI Express port multiplexer
20. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.1.2 7.1.2.1 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Functional description. . . . . . . . . . . . . . . . . . . . 5 General information . . . . . . . . . . . . . . . . . . . . . 5 Functional information . . . . . . . . . . . . . . . . . . . 5 Switch configuration . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 2 June 2006 Document identifier: CBTU0808_1

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